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1、PCB行业专业词汇大全一马建整理*ProcessModule前见：A. F料(Cut1.amination)a-1裁板(SheetsCutting)a-2原物料彝料(PaneI)(ShearmaterialtoSize)B. m/1.(Drilling)b-1内级(Inner1.ayerDrilling)b-2一次孔(OUter1.ayerDrilling)b-3二次孔(2ndDrilling)b-4雷射孔(1.aserDrilling)(1.aserAblation)b-5盲(埋)孔微孔(Blind&BuriedHoleDrilling)C.乾膜裂程(PhotoProcess(DF)c-1前
2、虑理(Pretreatment)c-2懿膜(DryFilm1.amination)c-3曝光(Exposure)c-4影(DeVek)Ping)c-5创阁(EtChing)F.甯(HorizontalElectrolyticPlating)f-1水平屯箱(HorizontalElectro-Plating)(PanelPlating)f-2貂甯(Tin-1.eadPlating)(PatternPlating)f-3低於1mil(1.essthan1milThickness)f-4高於1mil(Morethan1milThickness)f-5砂带研磨(BCItSanding)f-6集及Oft
3、(Tin-1.eadStripping)f-7微切片(Microsection)G.塞孔(PlugHole)g-1印刷(InkPrint)g-2很烤(Precure)g-3表面刷磨(Scrub)g-4彳兔烘烤(Postcure)H.防焊漆)：(SolderMask)h-1C面印刷(PrintingToPSide)h-2S面印刷(PrintingBottomSide)h-3静定哦堡(SprayCoating)h-4前虑理(Pretreatment)h-5ffi烤(Precure)h-6曝光(Exposure)h-7影(Develop)h-8接烘烤(Postcure)h-9UV烘烤(UVCUre)
4、h-10文字印刷(Printingof1.egend)h-11喷砂(Pumice)(WetBlasting)h-12印可射J滩防焊(PeclableSolderMask)I.i8金Goldplatingi-1金手指金(GoldFinger)i-2量i8软金(SoftNi/AuPlating)i-3浸金(ImmerSiOnNi/Au)(ElectrolessNiu)J.(HotAirSolder1.eveling)j-1水平口皮米苗(HorizontalHotAirSolder1.eveling)j-2垂直嗔羯(VerticalHotAirSolder1.eveling)j-3超级焊李场(Sup
5、erSolder)j-4.印焊羯突贴(SolderBump)K.成型(Profile)(Form)k-1携型(NCRouting)(Milling)k-2模具冲(Punch)k-3板面清洗烘帽(Cleaning&Backing)k-4V型槽(V-Cut)(V-Scoring)k-5金手指斜遏(BevelingofGF)1.短断路测(ElectricalTesting)(Continuity&InsulationTesting)1-1AOI光孥横杳(AOIInspection)1-2VRS目横(Verified&Repaired)1-3汛用型治具测(UniversalTester)1-4辱用治具
6、泅就(DedicatedTester)1-5Jiof泅就(FlyingProbe)M.终检(FinalVisualInspection)m-1懿板粉(WarpageRemove)m-2X-OUT印刷(X-OUtMarking)m-3包奘与出货(Packing&shipping)m-4目横(VisualInspection)m-5清洗与烘烤(FinalClean&Baking)m-6(ENTEKCu-IOdA)(OSP)m-7l子残除(IonicContaminationTest)(CleanlinessTest)m-8冷熟衡擘就瞬(ThermalcyclingTesting)m-9焊性I拭脓(
7、SolderabilityTesting)N.雷射孔(1.aSerAblation)N-I宙射疑Tooling孔(1.aserablationToolingHole)N-2雷射曝光封位孔(1.aSerAblatiOnRegistrationHole)N-3宙射Mask裂作(1.aSerMask)N-4指射疑孔(1.aSerAblation)N-5AoI横杳与VRS(AOIInspection&Verified&Repaired)N-6BlaserAOI(afterDesmearandMicroetching)N-7除牌渣(Desmear)N-8微创(Microetching)W(artwork
8、)底片Ablation烧溶（IaSelj,切除abrade粗化abrasionresistance耐磨性absorption汲取ACC(accept)允收acceleratedcorrosiontest加速腐例Iacceleratedtestacceleration速化反KBaccelerator加速甫Jacceptable允收activator活化液activeworkinprocess置隙在裂品adhesion附著力adhesivemethod黏著法airinclusion氟泡airknife.凰刀amorphouschange不定形的改燮amountamylnitrite硝基戊烷anal
9、yzer分析俄anneal回火annularring墓状蝌圈;孔璟anodeslime(sludge)陶楠泥anodizing随椀虑理AOI(automaticopticalinspection)H勤光学旅测applicabledocuments引用之文件AQ1.sampling允收水型抽棣aqueousphotoresist液憩光阻aspectratio横比（厚宽比）Asreceived到货畤backlighting背光back-up整板bankedworkinprocess留在裂品basematerial基材baselineperformance基隼然效batch批betabackscat
10、tering只他射照耀法beveling切斜透;斜透biaxialdeformation二方向之燮形black-oxide黑化blankcontroller空白封照组blankpanel空板blanking挖空blipblister氟泡;起泡blistering嬴泡blowhole吹孔board-thicknesserror板厚籍bondingplies黏州曹bow;bowing板修breakout优平墓内破出bridging搭插;橘接BTO(BuildToOrder)burning烧焦burr毛遗（毛SDcamcorder一髓型搦放搬carbide碳化物carlsonpin定位梢carrie
11、rcatalyzing催化catholicsputtering除楠湿射法caulplate隔板;纲板calibrationsystemrequirements校瞬系统之各种:要求centerbeammethod中心光束法centralprojection集中式投射certification懿阔chamfer倒角（金手指）chamfering切斜透;倒角characteristicimpedance特性阻抗chargetransferoverpotential需用得遮遇密座chase辆框checkboard棋盛chelator蟹和剧chemicalbond化孽维chemicalvapordepo
12、sition化学蒸著circumferentialvoid问周性之孔破cladmetal包夹金属cleanroom熊廛室clearance冏隙coat外表coatingerrorcoefficientofthermalexpansion(CTE)熟澎服系数coldsolderjoint冷焊站cold-weld金粉末冷焊color色colorerror颜色第睽compensationmcompetitiveperformancefl宇力绩效complexsalt绪化物Complexor籍化物componenthole零件孔componentside冬件面concentric同心conforman
13、ce密贴性consumerproducts消费性崖品contactresistance接阻continuousperformance速短疲押效能controlledsplitcontractservicet力胸均裂式conventionalflow就流方式conventionaltensiletest傅统张力测法conversioncoating突出斡化屠convexcoordinatelist资料清罩coppercladedlaminates(CC1.)纲箔基板copperexposure名泉路露铜coppermirrorcopperpad铜箔RI配copperresidue(coppers
14、plash)铜渣corrosionratenumbering腐速率St数系统corrosionresistance抗触性coulombslaw库偷定律countersink喇叭孔couponcouponlocation就棣黠coveringpower遮力CPU中心虑理器crack裂开;裂痕crazing裂痕;白斑crosslinking交聊聚合crosstalk呼鹰作用crosslinking交crystalcollection结晶收集curing聚合假currentefficiency宙流效率cut-outs挖空cutting裁板cyanide融化物cyclesoflearning孽者循琪c
15、ycle-timereduction交期缩短datecode遇期deburring去毛Sldedicated理用型degradation退燮delamination分居dent/pinhole凹陷/剑孔departmentofdefense阈防部designation字礁曾示法de-smeardeveloping撤影dewetting缩翎dewettingtimedimensionerror外形尺寸籍dielectricconstant介用i常数difficulty困期度difunctional燮功能dimension尺寸dimensionstability尺寸安定性dimensionalst
16、ability尺度安定性dimensionandtolerance尺寸典公差dirtyhole孔内其物discolorhole孔黑;孔灰;辄化discoloration燮色disposableeyeletmethod消耗性娜打法distortionfactor尺寸燮形函数doubleside曼面板downtime停械畴制drill物1.drillbit则drillfacet尖切前面drillpointer统尖重（研）磨横drilledblankboard已孔之裸板drilling畿孔dryfilm乾膜ductility延展性economyofscale湾规模edgespacing板避空地edg
17、e-boardcontact(goldfinger)金手指efficiency能量效率electrictestelectricaltesting宅测;消愀electrochemicalmachineECM甯化孥加工法electrochemicalreactor宣化孽反鹰器electroformingelectrolessplate化孥铜electroless-deposition舞蔻electropolishing量解抛光electrorefining冕解精electrowinning电解革取ellipticalset椭IQl形embrittlement脆性entitlementperform
18、ance可逢成处t效entrapment雄物failure故障fastresponseepoxy璟氧榭酯equipotential母位errordatafile做铜速率昇常情形etchrateetchants回刻液etchbackevaluationprogram曝光部估用程式exposureexternalpinmethod御夕m外部插梢法eyeletholeEyeletting布鲫眼fabric快速回鹰flux助焊伸Jfoildistortionfault瑕疵;缺陷fiberexposurefiberprotrusion雉突出fiducialmark光孥黠,基虢filler填充料film底
19、片filtration遇滥finishedboard成品fixing固著fixture甯泅交具（治具）flakingoff粹雕flammabilityrating燃性等级flare喇叭形孔flatcable伊排定缱feedbackloop回微循琮first-in-first-out(FIFO)先暹先出flexiblemanufacturingsystem(FMS)弹性装造系毓铜盾燮形fold空泡foreigninclude巽物foreignmaterial基材内混物freeradicalchainpolymerization自由基迪箱聚合fullyadditive加成法fullyanneale
20、dtype做底回火例化之形function函数fundamentalandbasic基本fungusresistance抗微性funnelflange喇叭形摺翼galvanized加法尼化裂程gap缱尖分ygaugelength有效艮度geltime膝化暗冏generalresistink一般阻倒油墨general通渝generalindustrial一般性（电子）工柒级geometricallevellingt何平整glasstransitiontemperature(Tg)玻璃憩抑换温度Gold金goldfinger金手指goldplating金goldenboard襟型板gouges刷磨
21、凹清gouging挖破grainboundary金厩晶能之四透green色gripgroundplane接地接groundplaneclearance接地空璞hackers骇客HA1.(hotairleveling)haloing白透;白圈hardener硬化，Jhardness硬度hepafilter空氧液清器highperformanceindustrial高性能（量子）工槊被highreliability高牢除度highresolution高解析度hightemperatureelongation(HTE)高温延展性铜箔hightemperatureepoxy(HTE)高温树能hit数孔
22、械举holecounterholediametererror孔错凑孔彳里holediameterholelocation孔教孔位holenumberholewallquality外弧孔壁品看hookhotdip哈氏槽熟浸法hullcellhybrid氢维混成植的量路hydrogenbondinghydrolysis潟法冶金法水解hydrometallurgyimageanalysissystem影像分析系统imagetransfer影像朝移immersiongoldplating浸SS法impedance红外幺泉重熔inhibitor射模ink内外用insulationresistance糜在
23、的位置intensifier浸金（化猱金）immersionintermolecularexchange相互速通ioniccontaminantscontaminationtestingIPA阻抗熟聚合抑制洌油墨电阻增演器交互改燮雌千性污染物蹄子污染就瞬出丙醇infraredreflowinjectionmoldinnerlayer&outlayerintendedpositionintensityinterconnectionionicinspiration（敬蒙）identification硅I留言十剧目襟implementation改善方案informationWinternalizat
24、ion制度化invisibleinventory熊形的痒存knifeedges刀Knoop努普（硬度眼位）kraftpaper牛皮纸laminarflow眉流laminate基屠板laminating联合lamination魔合laminator艇膜横land焊整layback力角磨损layup到1合控板layoutMi局leadscrew率引螺leakage漏电learningCUrVe孥和H掰legend文字leveling平整levellingadditive平整，levellingpower平整力lifesupport维繁生命limitingcurrent椀限电流linespace怨距
25、linewidth名泉宽linearvariabledifferentialtransformer(1.VD1.)然性可燮差勤榔换器liquid液状健）liquidcrystalresins液晶树脂liquidphotoimageablesolderresistink液憩感光防焊油墨liquidphotoresistink液憩光阻座!油墨lotsize批量lowercarrier底部承截板mechanicalplating械械法machinescrub刷磨清澈法macrothrowingpower巨分f布力margin刃带marketshare市埸估有markingerror文字籍联maske
26、dleveling假装平整masslamination大型里板masstransfermasstransferoverpotentialft员停遍谩密里masstransportationmasterdrawingmealingmaterialusefactor材料运用率泡黠;白黠memory,把1恿装置meniscographsolderabilitymeasurement新月型焊副效果microetch微microetching微触microfocus微焦距microfocussystem微焦距系统microprofile微表面microsectioning微切片法microthrowin
27、gpower微分怖力migration遭移mini-tensiletester迷你技力测,试倭misholelocationmisregistration焊*场面典零件面封位偏差misregsitrationmoistureandinsulationresistancetest源氧典霓阻3膝moldedcircuitboard(MCB)模耍屯路板monoethanalamine甲乙招氨monohydratestate分子膜;孽胸mousebite空秒mufflefurnace超大IC型侈品片模匆1)mylarNCdrill反回触negativefilmfl报耙角水化物monomer貂诙;刻缺口
28、msec高温焚火墟multichip保;渡膜nailhead数位孔械negativeetchback翼片negativerakeanglenetwork迪路;绸路neutralization中和nick缺口nickelnodule不流邮旨noise襟示nominaldimension糕示爆性畤IWnominalresincontentHow棵示厩流地铜制;淑粒noflowresinftKnominal摞定艮度nominalgeltime檄示感含盘nominalresinnominalscaledflowthickness襟示比例流盘厚度OAequip瓣公室自勤化段借obsolescencefa
29、ctor辍1襄因素OEM原没借裂造商offset-listohmmeter欧姆;汁open断路opencircuits斯路openshorttesting断短路测就opening11口originalartwork(AW)其它outgrowth牛刀被overlap蕊板overpotential氧化oxidetreatment氧化性之细包色素oxygenevolution充填床式padpad露铜panel一次铜冕parasitic原稿底片Others增出OVerdesign尖重置overlayentry遇电艇oxidation黑化虞理OXidCdcytochrome辄靠彝生反packedbed羯
30、整;ll配padcopperexposure小型板面;母板panelplating寄生的partno.料虢patternplatingboard)印刷电路板二次铜量SSPCB(printcircuitpcs片peelstrength抗撕赣度peelingoff余懒倒落）performancespecification性能规篦permittivity透母率perspectivesonexperience纯瞬透视PET聚幅photodiodedetector彝光二械能值测器photoinitiatorphotoresist光眼phototool子板子光具（指工作底片）piecepincetonap
31、pliedresearch腐i定倭pinkringPit脚距凹黠pitchplanar平面platingplatingexposure下露出pluggauge插规plughole孔塞PN1.(panel)排板polar-polarinteraction插性之IHj的吸力polyester聚陶旗polyglycols聚时臃氨poorbevelling聚乙二醇磨透加工引起突起,刹雌polyimidcpoordrill孔形不良poorHA1.字聘不良poorpad印刷偏差poorsolderability衲渐1不良positioncontrolsystem喷不Rpoormarking翱塾不Rpoor
32、printed焊性不良poortouch-up位置限制系统positiverakeangle正携耙角powercurvemodel幕次曲伤!模式practice工套惯例preferred良好prematuretearing提前撕裂PrePOlymerf11聚合物prepreg腮片pre-process(front-end)裂前press里床presscycle限合遇期primarycurrentdistribution一次电流分彳布primary主要productlifetimes生命超期productprocess裂程promoterprotocal初步资料prussicacid普离土酸PT
33、F-basedprocess厚膜糊法PTH(platingthoughhole)醇通孔pumicepullaway浮石粉pumicescrub火烧法冷QC(qualitycontrol)扁方型封装时qualificationinspection资格检定qualityclassification嗔砂清i粼法pyrometallurgy品管QFP(quadflatpack)资格雷查检瞬qualificationtesting品Tt等级quantitativerack二卦架radiometer能侬弹rakeangle报耙角RAM(RandomAccessMemory随搬存取的realtimeHWO寺
34、刻recessedtraceprocess凹槽路法recoverytank回收槽reduction遢原re-eninforcement/化refraction折光率reinforcementstyle封位用棕Saregistrationhole片方形制地REJ(reject)拒收releaseagent浮雕角remark修理resincontent腮流量resinflowpercentage树脂下陷resinsmear刺乾膜朔resistornetwork解像度彳南强材料的型式registermark封位孔registrationpattern退Ir拒收rejectable脱模弹reliefa
35、ngle树脂含侬（媵含成）榭脂流盘之百分率席渣排列雷阻returnonassetsresinflowresinrecessionresiststrippersresolution资羟辍酬率reversibility可逆性rework重工rosinH然松香rotatingcylinder旋脚Ily柱形roughtness孔壁粗糙;粗慢routing切外形,成型routingbit跣刀runout偏穗S/1.onhole孔内沾文字S/M(soldermask),S/1.防焊文字S/M(soldermask)防焊S/MerrorS/Monholesaltspraytestsamplingsize抽棣
36、敷scopescored刻痕scoring桐槽;刮scrapscratches刮像screenprinting国8版印刷scum透亮残膜sealing封孔虞理secondary次要semi-additive半加成法sensitize敏化sensitizer敏化液separator纲隔板sequentiallamination渐成式摩法serratededges毛逊shatter裂开short短路shunt分路silanetreatment矽烷虑理siliconecouplingagentsilkscreen文字印刷simulator模掇器singleaxisifsizingskip湖印skip
37、printing跳印;漏印sliver槽繇脩slotslottingp11槽SMD(surfacemountdevice)表面黏著元件smear解渣SMT(surfacemounttechnology)表面黏著技衙sodiumcarbonatemonohydrate%li晶水碳酸softtoolingsolder焊蜴；Wsolderbridgesolderbumpsolderfloatsoldermaskadhesion绿漆附著力solderonG/F金手指沾羯solderontracesolderplug弱塞solderside焊面solderability焊翎1solidcarbide碳化
38、物spacing距spacingnoncnough我距不足SPC(StatisticalProcessControl)统烹十生管specificationspecialconsiderations特别考J出spincoating旋郦壅佛spindle舞岫spiralContractometer螺旋收缩倭spotfacespraycoatingSqueegec刮刀stackingstructure鞭板结横stamping河槌standardhydrauliclamination襟型液睦法StandardiZing襟，化starvation缺腭steptablet格片敷stockoption熬股送挥榷strain感度强度stressmeter减除法surfaceconvexstrength鹰力舒*subtractive表面突起surfaceexamination表面相!查surfaceinsulationresistance(SIR)surfacemount表面粗糙度surges路
