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1、IECIECTR61191-9Edition1.02023-06TECHNICA1.REPORTco1.ourinsidePrintedboardassemb1.ies-Part9:E1.ectrochemica1.re1.iabi1.ityandioniccontaminationonprintedcircuitboardassemb1.iesforuseinautomotiveapp1.ications-BestpracticesTHISPUB1.ICATIONISCOPYRIGHTPROTECTEDCoPyright2023IEC1Geneva,Switzer1.andAJ1.right
2、sreserved.UnteesO1.herWigespecified,nopartofthisPUb1.iCabonmaybereproducedoruti1.izedinanyformOfAanymeans,e1.ectronicormeca11opyigandmcro1.m,WAhOSpermissioninwntngfromeitherIECofIECmemberNationa1.Committeeinthecountryoftherequester.IfycuhaveanyquestionsaboutIECcopyrighthaveanenquiryaboutOb1.aninganc
3、ona1.rightStothsPUbtCagn.pte-ascontacttheaddressM11oryour1.oca1.IECmc11crNatKXI霖COmn1.inCfxfurtheri11formatkx.IECSeaeiariaiTd.:412291902113.ruedeVarembe,Mca1.Commtsskxi(IEC)isth1.eadinggota1.organizationthatpreparesandpunishes1.nf11abona1.Standards1.ota1.1.e1.ectricai.Gectronicandre1.atedIechnoksgie
4、s.AboutIECpub1.icationsThetechnica1.contortdIECpub1.ications$keptunderconstantreviewbyIbCIECP1.cascmakesurothatyouhavethe1.atestedition,ayaIafteCyotcriteria(referencenumber,texttechnica1.oommittcat3reteased.Avai1.ab1.eon1.ineandCnCeamonthbyemai1.IECCustomerServiceCentre-webstore.1.ec.chescIfyouwhtog
5、rveuyourfeedbackonthispub1.icationorneedfurtherasstsia11,p1.easecontacttheCustomerServiceCnure.satesec.ch.IECProducts&ServicesPor1.a1.products.icc.chDiscoverourPCWCrfU1.soarcengineandrcshaveaccessiouptoda1.eco11W11ttai1.oredtoyourneeds.EIaetrOPed3www.Hectropedia.orgTheVVOfIcfsIeadngon1.inedictionary
6、ondectrotechno1.ogy,nia11ingmorethan22300trm11otogicanw*C1.MwrfHdF吐cECnr加8CONTENTSFOREWORD5INTRODUCTION71 Scope82 Normativereferences83 Terms.M1.irUIiOnSandabbreviatedterms83.1 Termsanddefinitionsre1.atedtomanagement93.2 Technica1.termsanddefinitions93.3 3Abbreviatedterms104 Fai1.uremodee1.ectrochem
7、ica1.migration101 .1Backgroundofe1.ectrochemica1.migration104 2C(xnp4e1.yofe1.ectrochemica1.migration125 3Conductiveanodicfi1.ament(CAFandanodicmigrationphenomena(AMP)136 .4Creepcorrosion145 E1.ectrochemocaJmigrationandre1.evanceofionic11tamination155.1 Genera1.aspects155.2 Backgroundofioniccontamin
8、ationmeasurement155.3 Restrictionsand1.imitationsofIonccontaminationmeasurementficcontaminationmeasurementtorc1.eanedproducts285.5 Howtodo-Guidancetousecases375.6 Examp1.estorgoodpractice406 Surfaceirsutaonre1.iance(SIR)4361SIR-Abinationsandfau1.typrocessing436.1 Fundamenta1.parametersofinf1.uenceon
9、SIR436.2 3HarmonizationofSIRtestconditionsforcharacterizationofmateria1.sforautomotiveappfccations516.3 DifferentstepsofSIRtesting517 ComprehensiveSIRtesting-B52-approach557.1 Genera1.aspects5572ThemainB52testboard567.3 Thetestpatterns577.4 ProcessingofB52boards597.5 Samp1.eSaeforSIRtestingotB52test
10、coupons597.6 6PreparationforSIRtesting597.7 SequenceofSIRtesting6078Eva1.uation628 Eam*etorgoodpractice628.1 1Methodo1.ogyformateria1.andprocessquaMication.processcontro1.6282Step1-Materia1.qua1.ification628.3 Step2-ProductdesignverificationandprocessVHidatiOn48.4 Step3-Definitionofprocesscontro1.1.
11、imits65AnnexA(informative)S1.RmeasurementforSMTso1.derpaste-Representativeexamp1.e.67A_1Purpose87A2Equipment67A.3ExampJeofaninstructionhowtoperformthetest67Bib1.iography70Figure 1 -PrindPB1.reactionmechanismofECM11Figure 2 -Uncertaintyin1.oca1.nditionsdeterminesECMfai1.ures11Figure 3 -OccurrenceofEC
12、Mfai1.uresduringhumiditytests12Figure 4 -VENNdiagramshowingthefactorsinf1.uencingECM13Figure 5 -OccurrenceofCAFandAMP14Figure 6 -Creepcorrosioncausedbycorrosivegases15Figure 7 -kiccontaminationmeasurement16FigWe8-PdnCa1.operationmode(f1.uidIIoW)ofROSE17Figure 9 -Effectofso1.ventcompositiononthobtain
13、edROSEresu1.ts18Figure 10 -Effectofso1.ventcompositionontheobtainedioncromatograpyresu1.t18Figure 11 -CompahsonofROSEva1.uesWrthdifferentso1.ventmixturesandmateria1.variationsoftheCBA21Figure 12 -VariationinROSEva1.uesdependingontechno1.ogyused22Figure 13 -Destructiveactionofso1.ventonresinmatrix23F
14、igure14-COmPar1.SOnofthere$mchange23Figure15-Destructiveactionofso1.ventonresinmatrixandchippingeftect24Figure16-Assemb1.ymanufacturedWith2xSMTandIXTHTprocessforthen11ector28Figure17-CompahsonofSPC-chartsfrom1-yearmonitoringofditterentCBsuppersandtwodifferentiSfina1.finishprocesses29Figure 18 -Diffe
15、rencesinROSEva1.uesforunpopu1.atedCBsdependingontheextractionmethod30Figure 19 -ReductionofoiccontaminationonbareCBs(stateofde1.iveryfromCBsupper)byIeadfreereftowstepWIhOutsoWerpasteorcomponents32Figure 20 -Inf1.uenceofcomponentsontheoniccontaminationbasedon%re而FnabonawhiteveorresdueonM1.CCsduringac
16、tivehur1.ftytest：.：3Figure 22 -Chromatogramderivedfromionchromatographymeasurementofac1.eanedCBA36Figure 23 -Approachforachievingobjectiveevidenceforaquak1.iedmanufacturingprocessintheautomotiveindustry41Figure 24 -ROSEasprocesscontro1.too1.42Figure 25 -VieWonSIRmeasurement44Figure26-Principa1.cours
17、eofSIRcurves45Figure27-ResponsegraphConCtKningstabi1.izedSiRvaJuoafter168hfromaDoEwithB53simi1.artestcoupons(bareCB)45Figure28-SIRmeasurementwithB24-CB.no-c1.eanSMTsoWerpaste46Figure29-IncreaseinECMpropensitydependingonvo1.tagapp1.ied(SandCuCuds1.a11cesM)ofcombstructures48Figure30-1.ayoutofB53testco
18、upon49Figure31-B53withSoIdermask,partia1.1.ycoveredandfuycoveredcombstructures53Figure32-B52CBAafterSMTprocess.1.ayoutspanyinterna1.1.ayoutru1.es56Figure 33 -PatternofB52CB.1.ayoutS1.ightfyadaptedtofuHpanyinterna1.1.ayoutru1.es57Figure 34 -Pos4iveexamp1.eofcomprehensiveSIRtestsOtxainedforqua1.ificat
19、ionofaSMTprocess61Figure 35 -Negativeexamp1.eofacontaminatedB52-sam1.e.testedbythesequenceOfconstantc1.imateandcyc1.icdampheatc1.imate61Figure 36 -SIRtostcoupon,simi1.artoB53,forprincipa1.materia1.qua1.ification63Figwc37-SIRtestwithconstantc1.imateandcyc1.icdampboatcondition63Figure 38 -B52testboard
20、andexamp1.eofSIRcurve64Figure 39 -Exampteoftheproductthatwasrea1.izedbyIhereteasedmateria1.sandprocess64Figure 40 -Ioniccontaminationtestresuhsfrom4repetitionsofPVsamp1.es65Figure 41 -Resu1.tsofionicressduetestingandca1.cu1.ationofuppercontro1.1.imit(UC1.)65Figure 42 -Runchartderivedfrom2samp1.esper
21、monthduringmassProduC1.iOn66Tabte1-UstofionsbasedonIPC-TM650.2.3.28(2126TaW2-Fingerprintafterk)nchromatographyofnoc1.eanassemb1.yshov/ninFigure1627Tabte3-FingerprintafterionchromatographyofbareCBs(stateofde1.ivery)31Tab1.e4-FingerprintafterionchromatographyofabareCBandtherespectivePBAinunceaedandc1.
22、eanedcondition35TabAe5-Fingerprintafterk)nchromatographyofanUnCieanedCBAcomparedtothec1.eanedCBAandafterremovingthecomponents37TaWe6-CommontestCon(MiOnSforbasicmateria1.eva1.uation51TaWc7-RocommendcdSIRtostconditions1.TheIfWnatKXiaE1.ectrotechnica1.Commission(IEC)aWa1.dW1.deorgamzabonforstarSafdzato
23、COfrpcis1.ng11abo11a1.e1.ectrotechnica1.111mitt0es(ICNationa1.CommtteesjTbeobjectofEC场toPrCO1.O伯irtemaicooea!ionona1.1.questionsconcerningstandardizationintheetec!hca1.anddecronic1.Wds.Tohendandinadf1.tootherac!rvrties.IECpunishesInternabona1.Standards.TechnbaiSpTO1.icaIkxisTechnica1.Repo11s.Pub1.ic
24、1.yAvai1.ab1.eSpecificaiione(PAS)andGudes(hera11ereferredtoaIECPuWica1.ion(三).Tberprepara1.kxsentrustedIotechnica1.mmrttes;anyECNationa1.Committeeinterestedin!hesubjectdea1.twthmaypartiopaX?inthisproparaXxywkIn1.omationa1.governmenta1.andnongovcrnnxjn1.a1.organizations1.iaisingWiIhthe1.Ca1.sopccorda
25、11ccwthconditionsdo1.crr11cdbyagreementMwoRn出。MQorganizations2Thekxma1.dediororagreementsofIEContechnica1.matersexpress,asnear1.yassstMe.aninernationaico11sesiofopiniononthere1.evantsuimitteehasrepresentationfromainfesdIECNationa1.Comminees.31IECPub1.icationshavethekxmofrecommendationsfxinternationa
26、1.useandareaccepdbyIECNationa1.Convnfttwsinthtsense.Vik?a1.1.reasonab1.eon.7NoIabikrysha1.1.attachtoIECorwdifecxs.emp1.oyees.servantsOfagentsGdudIngindividua1.expertsandmembersit$ImtocsandIECNationa1.COmmatoeSforanypersona1.injury,propertydamageCfihfdamageofanynatureatsoevec,whetherdirectorIndifeC1.
27、orforsts(11dudng1.ega1.teesandexpensesarisingoutOfIhepuWcato,useo4.orreanceupon.thisECPub1.icationoranyotherECPubications.8AttenoonisdrawnktheNOfmatfVeretetencesCfiedthisPUMCat1.On.UseottherierencedpubUcat1.onssi11dispc11saWcfortheCOrgCtappcabonofthispuWicatio119Atientionisdrawn10Iheposibitythatsome
28、ofthedements0!thisIECPubicabonmaybethesubjecto1.patentrights.ICShaHnotbehe1.dresporto1.etorIdentity1.nganyora1.1.suchpatentrights.IECTR611919hasbeenpreparedbyIECmittee91:E1.ectronicsassemb1.ytechno1.ogy.ItisaTechnica1.Report.ThetextofthisTechnica1.ReportisbasedOathefo1.1.owingdocuments:DraftReporton
29、voting91/181VDTR91125ARVDTRFu1.1.informationonthevotingforitsapprova1.canbefoundinthercpodonvotingindicatedIntheabovetab1.e.The1.anguageusedforthedeve1.opmentofthisTechnica1.ReporttsEngfcsh.Thisdoc11wtwasdraftedinaccordancewithISOiECDirectives.Pan2,and(JcveiopedinacrdancewithISQ,IECDirectives.Part1a
30、ndISQ1IECDirectives.IECSupp1.ement,avai1.ab1.eatvw.ec.chmemters-experts.,refdccs.Themaindocumenttypesdeve1.opedbyIECaredescribedingreaterdetai1.atwyJeuctvpub1.ications.A1.istofa1.1.partsintheIEC61191series,pub1.ishedunderthegenera1.tit1.ePrintedboardassmbfs.canbefoundontheIECWobsite.Thefmncohasctwi1
31、.1.remainunchangedunti1.thestabi1.itydateindicatedontheIECWebSiteunder,ebstore.ec.chinthedatare1.atedtothespecificdocument.Atthisdate,thedocumentwd1.be renfirmd. withdrawn. rep1.acedbyarevisededition,or amended.IMPORTANT-Theco1.ourInside1.ogoonthecoverpageofthisdocumentindicatesthatitcontainsco1.our
32、swhichareconsideredtobeusefu1.forthecorrectunderstandingofhscontents.Usersshou1.dthereforeprintthisdocumentusingaco1.ourprinter.IntroductionThedocumentapp1.estoe1.ectronicand(Hoctromcchanicaiautomotivecircuitboardassemb1.es.Itdescribescurrentbestpracticesfordea1.ingwithe1.ectrochemica1.reactions1.ik
33、emigrationorcorrosionandoniccontaminationonthesurfaceofaprintedcircuitboardasonefai1.uremodeunderhumidity1.oad.ThisdocumentisaninformativedocumentwhichSerVeStoi1.1.ustrateIhetechnica1.1.yIeasibteoptionsandprovideabasforcustomerandsupp1.ieragroomonts.ItisnotintendedtoberegardedasaSPoCiHcabOnorstandar
34、dRe1.atedS1.andardSarcgatheredntheBiWiography.PRINTEDBOARDASSEMB1.IES-Part9:E1.ectrochemica1.re1.iabi1.ityandioniccontaminationonprintedcircuitboardassemb1.iesforuseinautomotiveapp1.ications一Bestpractices1 ScopeThispartofIEC61191.whichisaTechnica1.Report,app1.estoe1.ectronicande1.ectromechanica1.aut
35、onooniccontaminationonIhesurfaceofacircuitboardasonfai1.uremodeunderhumidity1.oad.Thisdocumentdea1.sWiththeeva1.uationofmateria1.sandmanufacturingprocessesforthemanufacturingot(Hoctronicassemb1.ieswith1.ocusontheirrekabi1.ityunderhumidity1.oads.Thee1.ectrica1.operationofadevicenahudenvironmentcantri
36、ggerea.dendritegrowth,cathoiccontamination,SIR(surfaceinsu1.ationresistance,impedancespectroscopy,etc.,whichareusedandinterpretedddfereni1.y.Theaimofthedocumentistoachieveauniformuseot1.anguageandto1.istthePOSSibMiesand1.imitationsofcommonmeasurementmethods.ThefocusOfIhedocumentisontheerrorpatternof
37、e1.ectrochemica1.migrationonthesurfaceofassemb1.eswithCath(Xcformationofdendrites.Eva1.uationofdifferenttestmethodsofcontro1.unitsunderhighhumidity1.oadarenotpartofthisdocument.2 NormativereferencesThefo1.1.owingdocumentsarereferredtointhetextinsuchawaythatsomeora1.1.oftheircontentconstitutesrequirementsofthisdocument.Fordatedreferences.Onfytheeditiontedapp1.ies.Forundatedreferences,the1.atesteditionofthereferenceddocument(i11c1.udtnganyamendments)app1.ies.IEC60194-1,Printedboardsdesign.manufactureandasembfy-
